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About me
About me
I’m a multidisciplinary engineer with a Ph.D. in Mechanical Engineering and a track record of hands-on work in semiconductors, battery technologies, and advanced composites. I’ve led plasma etch process development, performed cutting-edge microscopy and spectroscopy, and built functional prototypes using SolidWorks and lab instrumentation.
My career spans work in industry (Intel), national labs (NIST), and academia, giving me a unique lens to approach R&D, process scale-up, and production support. Whether it’s root cause analysis, process troubleshooting, or developing material systems for next-gen devices, I bring scientific rigor, creativity, and attention to detail.
Actively looking for opportunities within the process/equipment/manufacturing domain
Achievements
Achievements
Six Sigma Green Belt Certified
Pau Chang Lu Scholarship recipient for Fall 2023.
Graduate Student of the month for January 2022.
Travel grant for PACRIM-GOMD 2022, Panama.
Travel grant recipient for 2022 ASME IMECE NSF Track.
Eight peer-reviewed Q1 journal publications as the first author.
Regular conference attendance and publication.
Strengths
Strengths
Certified Lean Six Sigma Green Belt, experienced in DOE-driven problem solving, cross-functional teamwork, and supplier engagement to enhance material reliability and yield.
Top-down and bottom-up 2D material synthesis.
2D material selective transfer, thin film transfer.
Electrochemistry, microscopic, and spectroscopic data obtaining and analysis.
Regular troubleshooting and maintenance of glove boxes, pumps, and furnaces.
Goals
Goals
Improving focus.
Acquiring relevant skills that support growth.
Maintaining organization.
Supporting teamwork.
Skills
Skills
Process Engineering: FMEA, Root Cause Analysis (RCA), Design of Experiments (DOE), Statistical Process Control (SPC), 8D Problem Solving, Defect Characterization, Process Validation
𝐑𝐞𝐬𝐞𝐚𝐫𝐜𝐡 𝐒𝐤𝐢𝐥𝐥𝐬: Electrochemical, Analytical, Spectroscopic, Microscopic, Problem-Solving, Nanofabrication, DFT.
Analytical Techniques: SEM, TEM, XPS, Raman, FTIR, AFM, XRD, UV-Vis, Ellipsometry, Profilometry, Optical Microscopy
𝐄𝐥𝐞𝐜𝐭𝐫𝐨𝐜𝐡𝐞𝐦𝐢𝐜𝐚𝐥 𝐒𝐤𝐢𝐥𝐥𝐬: Process reversibility and Faradaic and capacitive analysis (GCD, 𝐂𝐕, 𝐝𝐐/𝐝𝐕), quantitative analysis of insertion-reaction type electroactive components and diffusive behavior analysis (𝐆𝐈𝐓𝐓), time and frequency domain analysis for adsorption, migration or diffusion behavior identification (𝐄𝐈𝐒).
𝐂𝐡𝐚𝐫𝐚𝐜𝐭𝐞𝐫𝐢𝐳𝐚𝐭𝐢𝐨𝐧 𝐒𝐤𝐢𝐥𝐥𝐬: Morphological and spectroscopic analysis for fine micro or nanoscale feature analysis, exploring crystallinity of materials and chemical bonding states.
𝐃𝐞𝐬𝐢𝐠𝐧 𝐚𝐧𝐝 𝐆𝐫𝐚𝐩𝐡𝐢𝐜𝐬 𝐒𝐤𝐢𝐥𝐥𝐬: Autocad, Solidworks, ImageJ.
𝐏𝐫𝐨𝐠𝐫𝐚𝐦𝐦𝐢𝐧𝐠 𝐒𝐤𝐢𝐥𝐥𝐬: MATLAB, C++.
𝗡𝗮𝗻𝗼𝗳𝗮𝗯𝗿𝗶𝗰𝗮𝘁𝗶𝗼𝗻 𝗦𝗸𝗶𝗹𝗹𝘀: 𝗖𝗹𝗮𝘀𝘀 𝟭𝟬,𝟬𝟬𝟬 (ISO 7) clean room training completion on 𝗘𝗕𝗟 and 𝗣𝗵𝗼𝘁𝗼𝗹𝗶𝘁𝗵𝗼𝗴𝗿𝗮𝗽𝗵𝘆 at NCMN Nanofab facility, top-down 2D material synthesis (micromechanical cleavage, liquid exfoliation, selective transfer process.
𝐓𝐡𝐞𝐨𝐫𝐞𝐭𝐢𝐜𝐚𝐥 𝐒𝐤𝐢𝐥𝐥𝐬: Modeling of the periodic structure, geometry optimization, electron density analysis, vibrational frequency analysis, transition state search (𝐕𝐀𝐒𝐏).
Advisor: Professor Gurpreet Singh
Former Member of Nanoscience and Engineering Lab
Former Member of Nanoscience and Engineering Lab
Kansas State University
Department of Mechanical and Nuclear Engineering
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