Embedded Files
About me
About me
Iโm a multidisciplinary engineer with a Ph.D. in Mechanical Engineering and a track record of hands-on work in semiconductors, battery technologies, and advanced composites. Iโve led plasma etch process development, performed cutting-edge microscopy and spectroscopy, and built functional prototypes using SolidWorks and lab instrumentation.
My career spans work in industry (Intel), national labs (NIST), and academia, giving me a unique lens to approach R&D, process scale-up, and production support. Whether itโs root cause analysis, process troubleshooting, or developing material systems for next-gen devices, I bring scientific rigor, creativity, and attention to detail.
Actively looking for opportunities within the process/equipment/manufacturing domain
Achievements
Achievements
Six Sigma Green Belt Certified
Pau Chang Lu Scholarship recipient for Fall 2023.
Graduate Student of the month for January 2022.
Travel grant for PACRIM-GOMD 2022, Panama.
Travel grant recipient for 2022 ASME IMECE NSF Track.
Eight peer-reviewed Q1 journal publications as the first author.
Regular conference attendance and publication.
Strengths
Strengths
Certified Lean Six Sigma Green Belt, experienced in DOE-driven problem solving, cross-functional teamwork, and supplier engagement to enhance material reliability and yield.
Top-down and bottom-up 2D material synthesis.
2D material selective transfer, thin film transfer.
Electrochemistry, microscopic, and spectroscopic data obtaining and analysis.
Regular troubleshooting and maintenance of glove boxes, pumps, and furnaces.ย
Goals
Goals
Improving focus.
Acquiring relevant skills that support growth.
Maintaining organization.
Supporting teamwork.
Skills
Skills
Process Engineering: FMEA, Root Cause Analysis (RCA), Design of Experiments (DOE), Statistical Process Control (SPC), 8D Problem Solving, Defect Characterization, Process Validation
๐๐๐ฌ๐๐๐ซ๐๐ก ๐๐ค๐ข๐ฅ๐ฅ๐ฌ: Electrochemical, Analytical, Spectroscopic, Microscopic, Problem-Solving, Nanofabrication, DFT.
Analytical Techniques: SEM, TEM, XPS, Raman, FTIR, AFM, XRD, UV-Vis, Ellipsometry, Profilometry, Optical Microscopy
๐๐ฅ๐๐๐ญ๐ซ๐จ๐๐ก๐๐ฆ๐ข๐๐๐ฅ ๐๐ค๐ข๐ฅ๐ฅ๐ฌ: Process reversibility and Faradaic and capacitive analysis (GCD, ๐๐, ๐๐/๐๐), quantitative analysis of insertion-reaction type electroactive components and diffusive behavior analysis (๐๐๐๐), time and frequency domain analysis for adsorption, migration or diffusion behavior identification (๐๐๐).
๐๐ก๐๐ซ๐๐๐ญ๐๐ซ๐ข๐ณ๐๐ญ๐ข๐จ๐ง ๐๐ค๐ข๐ฅ๐ฅ๐ฌ: Morphological and spectroscopic analysis for fine micro or nanoscale feature analysis, exploring crystallinity of materials and chemical bonding states.
๐๐๐ฌ๐ข๐ ๐ง ๐๐ง๐ ๐๐ซ๐๐ฉ๐ก๐ข๐๐ฌ ๐๐ค๐ข๐ฅ๐ฅ๐ฌ: Autocad, Solidworks, ImageJ.
๐๐ซ๐จ๐ ๐ซ๐๐ฆ๐ฆ๐ข๐ง๐ ๐๐ค๐ข๐ฅ๐ฅ๐ฌ: MATLAB, C++.
๐ก๐ฎ๐ป๐ผ๐ณ๐ฎ๐ฏ๐ฟ๐ถ๐ฐ๐ฎ๐๐ถ๐ผ๐ป ๐ฆ๐ธ๐ถ๐น๐น๐: ๐๐น๐ฎ๐๐ ๐ญ๐ฌ,๐ฌ๐ฌ๐ฌ (ISO 7) clean room training completion on ๐๐๐ and ๐ฃ๐ต๐ผ๐๐ผ๐น๐ถ๐๐ต๐ผ๐ด๐ฟ๐ฎ๐ฝ๐ต๐ at NCMN Nanofab facility, top-down 2D material synthesis (micromechanical cleavage, liquid exfoliation, selective transfer process.
๐๐ก๐๐จ๐ซ๐๐ญ๐ข๐๐๐ฅ ๐๐ค๐ข๐ฅ๐ฅ๐ฌ: Modeling of the periodic structure, geometry optimization, electron density analysis, vibrational frequency analysis, transition state search (๐๐๐๐).ย
Advisor: Professor Gurpreet Singh
Former Member of Nanoscience and Engineering Lab
Former Member of Nanoscience and Engineering Lab
Kansas State University
Department of Mechanical and Nuclear Engineering
Page updated
Report abuse